News & Articles

Pre-orders Open for $4000 AMD Ryzen AI Halo Mini PC Developer Kits
Pre-orders Open for $4000 AMD Ryzen AI Halo Mini PC Developer Kits
AMD’s highly anticipated Ryzen AI Halo Developer Platform mini PC, featuring the powerful Strix Halo chip, 128GB LPDDR5x memory, and 2TB SSD, is now available for pre-order at $3,999 via Micro Center, with both Linux and Windows 11 Pro options but no confirmed shipping date yet.
AMD Begins Pre-Orders for Ryzen AI Halo Mini PC Developer Kits
AMD Begins Pre-Orders for Ryzen AI Halo Mini PC Developer Kits
AMD’s highly anticipated Ryzen AI Halo Developer Platform mini PC, featuring the powerful Strix Halo chip, 128GB LPDDR5x memory, and 2TB SSD, is now available for pre-order at $3,999 via Micro Center, with both Linux and Windows 11 Pro options but no confirmed shipping date yet.
Intel Socket LGA1954 for
Intel Socket LGA1954 for "Nova Lake" Spotted in Real Life, Confirms 2L ILM Design
Get a first look at Intel's next-gen LGA1954 desktop socket—designed for powerful Core Ultra "Nova Lake" CPUs with higher core counts and cache—featuring a new 2-lever locking mechanism and backward cooler compatibility with LGA1851 and LGA1700.
AMD Officially Unveils Ryzen 7 5800X3D 10th Anniversary Edition and Ryzen 7 7700X3D
AMD Officially Unveils Ryzen 7 5800X3D 10th Anniversary Edition and Ryzen 7 7700X3D
AMD has relaunched the Ryzen 7 5800X3D as a 10th Anniversary Edition with special packaging and a Carbice Ice Pad, touting it as the fastest DDR4 gaming CPU, and also introduced the new Ryzen 7 7700X3D with Zen 4 architecture and 3D V-Cache, both targeting gamers with competitive pricing.
NVIDIA Unveils RTX Spark: A Supercomputer-Class Processor for Windows PCs Featuring Agentic User Interfaces
NVIDIA Unveils RTX Spark: A Supercomputer-Class Processor for Windows PCs Featuring Agentic User Interfaces
NVIDIA has unveiled the RTX Spark, a groundbreaking consumer PC processor designed to revolutionize the Windows AI PC market with powerful local AI capabilities, advanced gaming performance, and deep software ecosystem support—directly challenging Apple and AMD with its Arm-based architecture, GeForce RTX "Blackwell" graphics, and seamless integration with Windows 11 Copilot+ devices.
ASRock iBox Fanless Mini PCs Receive Intel Panther Lake Upgrade
ASRock iBox Fanless Mini PCs Receive Intel Panther Lake Upgrade
ASRock has unveiled updated fanless iBox mini PCs for industrial use, now featuring Intel Core Ultra X7 358H or Ultra 5 325 CPUs, support for up to 128 GB DDR5 RAM with in-band ECC, robust aluminum chassis, and a wide array of high-speed connectivity options.
Samsung Exynos 2600 SoC Detailed: Features 3-Tier CPU and AMD RDNA 4 iGPU
Samsung Exynos 2600 SoC Detailed: Features 3-Tier CPU and AMD RDNA 4 iGPU
Annotated die-shots of Samsung’s new Exynos 2600 reveal a cutting-edge 2 nm monolithic chip featuring a powerful 10-core CPU, AMD RDNA 4-based Xclipse 960 GPU, and a next-gen NPU—all packed with massive on-die memory and advanced I/O, promising a leap in performance for smartphones, tablets, and ultraportable notebooks.
Kubb Fanless Mini PC Receives Intel Panther Lake Upgrade, Comes with a High Price Tag
Kubb Fanless Mini PC Receives Intel Panther Lake Upgrade, Comes with a High Price Tag
French PC maker Bleu Jour has refreshed its compact, passively cooled Kubb Fanless mini PC with Intel’s new Core Ultra X7 358H “Panther Lake” CPU and Arc B390 graphics, but the upgraded performance and premium aluminum chassis now start at €1,850—well into high-end territory for mini PCs.
NVIDIA
NVIDIA "Vera" CPU Benchmarks: Surpasses Intel Xeon and AMD EPYC in Certain Workloads
Phoronix’s exclusive benchmarks of NVIDIA’s new 88-core Arm-based "Vera" CPU reveal it outperforms the latest Intel Xeon and AMD EPYC chips in key data center workloads, signaling NVIDIA’s rapid ascent as a major force in the server CPU market.
AMD
AMD "Zen 7" Architecture to Utilize TSMC’s A14 Process Node and Enhanced Packaging Technologies
AMD is reportedly planning to manufacture its next-generation "Zen 7" CPUs—codenamed "Grimlock"—on TSMC's advanced A14 angstrom-era node, introducing major AI-focused features, new instruction sets like AVX10 and ACE, enhanced security, and exploring innovative packaging technologies such as Powertech's FOPLP for its future EPYC server processors.